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CYL Electronics provides
professional EMS for a variety of products, including
but not limited to, communication products, consumer
products, office appliances, medical and automobile products.
Our
manufacturing facility
has owned a complete
service system including product technique design,
purchase management, SMT, PCB insertion, test &
experiment, assembly, product delivery, and lead-free
soldering technology. It
has SMT production lines and through-hole
insertion and assembly lines
with X-Ray
inspection, laser inspection and 3D solder paste
inspection machines, high-speed Ball Grid Array (BGA) IC
programmers, solder ball mounting systems and other
processing equipment.
Current customers include
MOTOROLA, FUJITSU TEN, FUJIFILM and SAMSUNG.
Our
manufacturing facility is
ISO9001:2000 certified.
We apply
scientific methods to control and improve the process.
We implement
6σ
quality control system and SPC tool. We also comply with RoHS
standard to meet the environmental requirements.
We offer solutions to
improve the reliability, quality and cost effectiveness.
We are committed to providing you the highest quality
and services.
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Surface Mount Product Solutions
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Chip Mount Min Size:01005
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IC
Mount
Fine Pitch in 0.3mm of QFP
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BGA/Micro BGA
Dia.0.4mm with 0.8mm Pitch
Dia.0.3mm ball with 0.5mm
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Pitch CSP
Speed: 0.045S/unit
Size of PCB: 50x50~460x460
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Category of Chip 200 kinds(8mm)
Assembly and Test
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Preceding Process of Components
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Through-hole Insertion
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Flux Proportion and Spread
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Wave Oven Temperature Control
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Product Assembly
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Reball
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Programming
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Text Fixture Design
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Function Test
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X-Ray Inspection
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Automatic Optical Test
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Solder Paste Thickness Test
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Heavy Metal Test
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Solderability Test
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Strain Test
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Environmental Experiment
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